Poly(arylacetylene) molding compositions

Details Poly(arylacetylene) molding compositions Poly(arylacetylene) molding compositions

1974-01-02

1978-01-24

Turer, Richard B.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 4214, 260 4217, 260 4222, 260 4243, 260 47UA, 260875, 526285, C08K 714

Patent

active

040703339

ABSTRACT:
The invention relates to poly(arylacetylene) molding compositions and thermoset resins prepared therefrom. The molding compositions comprise blends of a polyacetylenically unsaturated prepolymer and from about 2 to about 70%, by weight of the prepolymer, of a monomeric acetylenically unsaturated aromatic compound having a melting point below about 185.degree. C. and a boiling point above about 250.degree. C. The polyacetylenically unsaturated prepolymer is a polymer of at least one polyacetylenically substituted aromatic compound, such as a diethynylbenzene, which prepolymer has a number average molecular weight of about 900 to 12,000 and contains about 5 to 20% by weight of acetylenic groups. Typical monomeric acetylenic aromatic compounds which are blended with the prepolymer are diphenylacetylene and diphenylbutadiyne.

REFERENCES:
patent: 3066119 (1962-11-01), Meriwether et al.
patent: 3300456 (1967-01-01), Hay
patent: 3519611 (1970-07-01), Hay
patent: 3705131 (1972-12-01), Korshak et al.

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