Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

1992-07-20

1993-09-07

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437207, 437209, 437214, 437217, 437220, H01L 2166

Patent

active

052428389

ABSTRACT:
A semiconductor chip 4 is fixed to an island portion 16 of a lead frame, an electrode pad 22 of the semiconductor chip and the inner end portion of an external lead 18 of the lead frame are connected with an electrically conductive thin wire 24 and the semiconductor chip 4 is sealed with plastic together with the island portion 16 and the inner end portion of the external lead 18. The external lead 18 is cut off and isolated from the frame portion 12 and, with the island portion 16 retained by the frame portion 12 via a connecting portion 14, the external lead 18 is made to contact a measuring terminal 10 of the testing machine to carry out the electrical characteristic test of the semiconductor chip 4. Thereafter, the connecting portion 14 is cut off to remove the frame portion 12. After the removal, or simultaneously with that, the external lead 18 may be formed.
According to this method, since the external lead is left rectilinear and, separated from the external lead, the frame portion is attached to carry out the test, the danger of the external lead being deformed is remarkably small and, further, the electrical contact with the test can be excellently maintained.

REFERENCES:
patent: 4716124 (1987-12-01), Yerman et al.
patent: 4874722 (1989-10-01), Bednarz et al.
patent: 4985988 (1991-01-01), Littlebury
patent: 5094982 (1992-03-01), Suzuki et al.
patent: 5133118 (1992-07-01), Lindblad et al.
patent: 5139973 (1992-08-01), Nagy et al.

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