High temperature adhesive

Stock material or miscellaneous articles – Composite – Of metal

Patent

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Details

4273722, 4273741, B32B 1508

Patent

active

052427552

ABSTRACT:
A substrate assembly and method for its preparation, said substrate assem comprising at least two substrates adhesively bonded with a cured thermosetting polymer being able to withstand a temperature of 200.degree.-400.degree. C. which polymer is derived from a diphthalonitrile monomer and/or prepolymer with an aromatic moiety in the bridging group which monomer and/or prepolymer is solid at room temperature but which is rendered liquid by heating it to above its melting temperature. Said monomer in liquid state, and its prepolymer in liquid state, have tack with respect to said substrate.

REFERENCES:
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patent: 4234712 (1980-11-01), Keller et al.
patent: 4238601 (1980-12-01), Keller et al.
patent: 4259471 (1981-03-01), Keller et al.
patent: 4408035 (1983-10-01), Keller
patent: 4409382 (1983-10-01), Keller
patent: 4410676 (1983-10-01), Keller
patent: 4619986 (1986-10-01), Keller
patent: 5003039 (1991-03-01), Keller
patent: 5003078 (1991-03-01), Keller
patent: 5004801 (1991-04-01), Keller et al.

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