Surface mount socket for an electronic package, and contact for

Details Surface mount socket for an electronic package, and contact for Surface mount socket for an electronic package, and contact for

1995-11-30

1998-05-05

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 83, H01R 909

Patent

active

057466084

ABSTRACT:
A socket for an electronic package comprises a dielectric housing having contacts each with a surface mount section extending below a bottom surface of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section of each contact has a convex bottom surface with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package. A contact having a convex bottom surface which simulates a solder ball is also disclosed

REFERENCES:
patent: 4447109 (1984-05-01), Hobart, Jr.
patent: 4691975 (1987-09-01), Fukunaga et al.
patent: 4948030 (1990-08-01), Chason et al.
patent: 5459287 (1995-10-01), Swamy
patent: 5562462 (1996-10-01), Matsuba et al.
International Search Report: PCT/US 96/18206.

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