Semiconductor device package assembly employing flexible tape

Details Semiconductor device package assembly employing flexible tape Semiconductor device package assembly employing flexible tape

1990-05-31

1991-12-24

Mintel, William

357 69, 357 72, H01L 2348

Patent

active

050757601

ABSTRACT:
A flexdible film substrate carries a pattern of conductive leads and mounting pads. The conductive leads have outer lead portions, and inner lead portions which terminate near to the mounting pads. Semiconductor chips are mounted face-up on the mounting pads and connected by wire-bond connections to the inner lead portions. A transfer molding process is used to encapsulate the semiconductor device assemblies leaving the outer lead portions protruding from the encapsulated material. The flexible film substrate supports the mounting pads and conductive leads during the wire-bonding and transfer molding operations.

REFERENCES:
patent: 4006047 (1983-02-01), Brummett et al.
patent: 4477827 (1984-10-01), Walker et al.
patent: 4661837 (1987-04-01), Sono
patent: 4706105 (1987-11-01), Masuda et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4772936 (1988-09-01), Reding et al.
patent: 4884124 (1989-11-01), Mori et al.
Japanese Kokai Patent No. Sho 58[1983]-178544, Marutsuka et al., Oct. 19, 1983.

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