Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1991-10-28
1995-09-05
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257668, 257675, 257705, 361723, H05K 720
Patent
active
054484502
ABSTRACT:
A lead-on-chip integrated circuit package comprising at least one extremely thin adhesive layer transferred from a carrier onto the face of integrated circuit chips, and a lead frame laminated to the last adhesive layer, with cured adhesive acting as an insulator, integrated circuit chip connection pads bonded to and encapsulating the chip and lead frame. Thermally conductive and electrically insulating filling may be included with the adhesive to improve heat conduction from the IC. Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated package improves the reliability of the integrated circuit package.
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Information allegedly written by Emory Garth regarding "Memory Stacks", Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when this information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K.times.16 CMOS sRAM Module and DPS512X16AA3 High Speed Ceramic 512K.times.16 CMOS sRAM Module, pp. 865-870, no known date.
Staktek Corporation
Thompson Gregory D.
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