Ceramic circuit board and semiconductor device using same

Details Ceramic circuit board and semiconductor device using same Ceramic circuit board and semiconductor device using same

1997-04-30

1999-08-24

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174261, 361779, 361719, 361720, 428901, H05H 720

Patent

active

059432128

ABSTRACT:
Thermal stress caused by a difference in the coefficient of thermal expansion between the mounting substrate and the ceramic substrate acts little on the junction portions of the external connection terminals when a semiconductor device is mounted avoiding such problems that the junction portions are broken or peeled off the mounting substrate. An insulating buffer layer 40 is adhered onto the mounting surface of ceramic substrate 32 having required wiring patterns 34 onto where the external connection terminals 12 will be connected, the insulating buffer layer 40 having a Young's modulus smaller than that of a ceramic material of the ceramic substrate 32 and having electrically insulating property, terminal pads 14 are provided on the outer surface of the insulating buffer layer 40, and the terminal pads 14 and the wiring patterns 34 are electrically connected together through buffer conducting portions 42 provided penetrating through the insulating buffer layer 40 and having a Young's modulus nearly equal to that of the insulating buffer layer 40.

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