Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-04-27
2000-10-17
Gaffin, Jeffrey
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174261, 174260, 439931, H05K 109
Patent
active
061335347
ABSTRACT:
A wiring board for electrical tests; having an insulating substrate, wiring of predetermined pattern which is embedded in the insulating substrate, and bump electrodes which are formed on the wiring and which are respectively brought into contact with corresponding electrodes of an article to-be-tested. Thus, even when the electrode pitch of the article to-be-tested such as a semiconductor device has become smaller(for example, less than 0.1 [mm]), the electrodes can be formed so as to cope with the electrical tests of the article.
REFERENCES:
patent: 3324014 (1967-06-01), Modjeska
patent: 3391457 (1968-07-01), Reimann
patent: 3677950 (1972-07-01), Carmelo
patent: 3912852 (1975-10-01), Simon
patent: 4277175 (1981-07-01), Karasaki et al.
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4374869 (1983-02-01), Dorey, II et al.
patent: 4421410 (1983-12-01), Karasaki et al.
patent: 4606787 (1986-08-01), Pelligrino
patent: 4707657 (1987-11-01), B.o slashed.egh-Petersen
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4790902 (1988-12-01), Wada et al.
patent: 4893404 (1990-01-01), Shrahata et al.
patent: 5017271 (1991-05-01), Whewell et al.
patent: 5028492 (1991-07-01), Guenin
patent: 5114878 (1992-05-01), Maruyama et al.
patent: 5118386 (1992-06-01), Kataoka et al.
patent: 5128612 (1992-07-01), Aton et al.
patent: 5192835 (1993-03-01), Bull et al.
patent: 5258577 (1993-11-01), Clements
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5272376 (1993-12-01), Ueno
patent: 5279711 (1994-01-01), Frankeny et al.
patent: 5350323 (1994-09-01), Boissel et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5499447 (1996-03-01), Murakami
patent: 5560795 (1996-10-01), Bruckner et al.
patent: 5629137 (1997-05-01), Leedy
patent: 5664325 (1997-09-01), Fukutomi et al.
patent: 5839190 (1998-11-01), Sullivan
Fukutomi Naoki
Itabashi Masahiko
Kaitou Kouichi
Kuwano Atsushi
Nakamura Hidehiro
Cuneo Kamand
Gaffin Jeffrey
Hitachi Chemical Company Ltd.
LandOfFree
Wiring board for electrical tests with bumps having polymeric co does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wiring board for electrical tests with bumps having polymeric co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring board for electrical tests with bumps having polymeric co will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-471220