Method and apparatus to wick solder from conductive surfaces

Details Method and apparatus to wick solder from conductive surfaces Method and apparatus to wick solder from conductive surfaces

1996-04-08

1998-05-05

Heinrich, Samuel M.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

B23K 300

Patent

active

057463670

ABSTRACT:
A system for removing solder from an area grid array pad by applying a wire mesh to a conductive surface of the area grid array that is covered with solder. Heat is applied to the wire mesh and the conductive surface of the area grid array so that the solder flows from the conductive surface onto the wire mesh. The wire mesh is removed from the conductive surface thereby removing all solder from the conductive surface of the area grid array.

REFERENCES:
patent: Re32086 (1986-02-01), Spirig
patent: 3434455 (1969-03-01), Maytone
patent: 3627191 (1971-12-01), Hood, Jr.
patent: 4934582 (1990-06-01), Bertram et al.
patent: 5072874 (1991-12-01), Bertram et al.
patent: 5083698 (1992-01-01), Forsha
patent: 5094139 (1992-03-01), Forsha
patent: 5284286 (1994-02-01), Brofman et al.
patent: 5305941 (1994-04-01), Kent et al.

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