Microelectronic connector with planar elastomer sockets

Details Microelectronic connector with planar elastomer sockets Microelectronic connector with planar elastomer sockets

1997-12-11

2000-10-17

Turner, Archene

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

29825, 29830, 29832, 29837, 29842, 29843, 438110, 438128, 438129, 438612, 438618, 216 2, H01L 2120

Patent

active

061330728

ABSTRACT:
A component for mounting semiconductor chips or other microelectronic units includes a compliant, sheet-like body with arrays of sheet-like conductive pads on upper and lower surfaces of the body. Flexible leads extending through the body interconnect conductive pads on the upper and lower surfaces. The leads are desirably formed from wire, such as gold wire, that is bonded to the conductive pads using a conductive epoxy or a eutectic bonding alloy. The component is made using sacrificial base sheets having conductive terminal portions to which the leads are initially bonded. The compliant body is formed by injecting a flowable material between the base sheets, curing the material and removing the base sheets by etching. The flowable material surrounds the leads such that the leads are supported by the cured compliant layer. The component may be used as an interposer or as a test socket.

REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 4067104 (1978-01-01), Tracy
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4326663 (1982-04-01), Oettel
patent: 4447857 (1984-05-01), Marks et al.
patent: 4520562 (1985-06-01), Sado et al.
patent: 4629957 (1986-12-01), Walters et al.
patent: 4661192 (1987-04-01), McShane
patent: 4667219 (1987-05-01), Lee et al.
patent: 4785137 (1988-11-01), Samuels
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4858074 (1989-08-01), Mallet et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4926241 (1990-05-01), Carey
patent: 4926549 (1990-05-01), Yoshizawa et al.
patent: 4949158 (1990-08-01), Ueda
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5047830 (1991-09-01), Grabbe
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5106308 (1992-04-01), Gollomp et al.
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5197892 (1993-03-01), Yoshizawa et al.
patent: 5230931 (1993-07-01), Yamazaki et al.
patent: 5254811 (1993-10-01), Ludden et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5282312 (1994-02-01), DeStefano et al.
patent: 5371654 (1994-12-01), Beaman et al.
patent: 5399982 (1995-03-01), Driller et al.
patent: 5430614 (1995-07-01), Difrancesco
patent: 5435732 (1995-07-01), Angulas et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5474458 (1995-12-01), Vafi et al.
patent: 5477160 (1995-12-01), Love
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5528083 (1996-06-01), Malladi et al.
patent: 5531022 (1996-07-01), Beaman et al.
"Method of Testing Chips and Joining Chips to Substrates", Research Disclosure, Feb., 1991, No. 322, Kenneth Mason Publication Ltd., England.

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