Metallized substrate for electronic device

Details Metallized substrate for electronic device Metallized substrate for electronic device

1988-11-21

1990-03-06

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428323, 428328, 428426, 428432, 428433, 428698, 428901, 174256, 361397, 106 112, 106 116, B32B 900

Patent

active

049065149

ABSTRACT:
Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase.

REFERENCES:
patent: Re30313 (1980-06-01), Carcia
patent: 4381469 (1983-04-01), Ogawa et al.
patent: 4671928 (1987-06-01), Herron et al.

Affiliated with

Also associated with

Rating

Metallized substrate for electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized substrate for electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized substrate for electronic device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-46699