Thin dielectrics over polysilicon

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357 236, 357 52, 357 59, H01L 2978, H01L 2702, H01L 2934, H01L 2904

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active

049491547

ABSTRACT:
The present invention teaches a new method for formation of thin dielectrics over polysilicon. This technique permits the fabrication of poly-to-poly capacitors with high specific capacitance (capacitance per unit area). This technique is completely compatible with standard MOS dual poly regrown gate oxide processes. The high value of specific capacitance is achieved by using a composite dielectric which has high dielectric integrity and whose thickness is completely independent of the formation of the regular gate oxide under the second poly. No extra mask steps are required. The composite dielectric is formed as a grown or deposited oxide followed by a deposited nitride which is then reoxidized. Optionally, a second oxide is deposited before reoxidation performed.

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