High fatigue ductility electrodeposited copper foil

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils

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428607, 428674, 428544, 205 50, 205291, C25D 104

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active

061328871

ABSTRACT:
This invention relates to an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes. In one embodiment, the foil is annealed, said foil being characterized by a fatigue ductility of at least about 65%. The invention also relates to a process for making an electrodeposited copper foil using an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm.

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PCT/US96/07918, PCT International Search Report mailed Mar. 10, 1997.
"A New Ductility and Flexural Fatigue Test Method for Copper Foil and Flexible Printed Wiring" by W. Engelmaier, 21st Proceedings of the Annual IPC Meeting, Washington, D.C. (Apr. 1978).
"Copper Foil for Flexible Circuits", D. Avery, Circuit World, 14(2) 16 (1988).
"Results of the IPC Copper Foil Ductility Round-Robin Study", W. Engelmaier, Testing of Metallic and Inorganic Coatings, 66 (1987).

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