Method for applying atomized adhesive to a leadframe for chip bo

Details Method for applying atomized adhesive to a leadframe for chip bo Method for applying atomized adhesive to a leadframe for chip bo

1998-08-13

2000-10-17

Pianalto, Bernard

Coating processes

Electrical product produced

4272071, 4272074, 427294, 427345, 427350, 4273855, 437225, B05D 512, B05D 510

Patent

active

061327980

ABSTRACT:
An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed for further prevention of adhesive application to undesired areas. A gas purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

REFERENCES:
patent: 3280019 (1966-10-01), Harding et al.
patent: 3311085 (1967-03-01), Smith
patent: 3568638 (1971-03-01), Isaac
patent: 3675563 (1972-07-01), Metreaud
patent: 3887421 (1975-06-01), Hudson et al.
patent: 4019458 (1977-04-01), Kolterer
patent: 4385083 (1983-05-01), Shelley
patent: 4409924 (1983-10-01), Laverty et al.
patent: 4599970 (1986-07-01), Peterson
patent: 4720740 (1988-01-01), Clements et al.
patent: 4729809 (1988-03-01), Dery et al.
patent: 4734152 (1988-03-01), Geis et al.
patent: 4857367 (1989-08-01), Thorn et al.
patent: 4919076 (1990-04-01), Lutz et al.
patent: 4924801 (1990-05-01), Arnone
patent: 5024867 (1991-06-01), Iwabuchi
patent: 5057456 (1991-10-01), Dehaine
patent: 5066522 (1991-11-01), Cole et al.
patent: 5073517 (1991-12-01), Iwabuchi et al.
patent: 5076485 (1991-12-01), MacKay
patent: 5094976 (1992-03-01), Iwabuchi et al.
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5147812 (1992-09-01), Gilbert et al.
patent: 5187123 (1993-02-01), Yoshida et al.
patent: 5196082 (1993-03-01), Randolph
patent: 5221642 (1993-06-01), Burns
patent: 5225966 (1993-07-01), Basavanhally et al.
patent: 5240746 (1993-08-01), O'Connell Litteral
patent: 5246730 (1993-09-01), Peirce et al.
patent: 5258577 (1993-11-01), Clements
patent: 5258647 (1993-11-01), Wojnarowski et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5306345 (1994-04-01), Pellet et al.
patent: 5308648 (1994-05-01), Prince et al.
patent: 5326399 (1994-07-01), Takamura
patent: 5362354 (1994-11-01), Okura et al.
patent: 5373110 (1994-12-01), Inasaka
patent: 5423889 (1995-06-01), Colquitt et al.
patent: 5444923 (1995-08-01), Romm et al.
patent: 5447596 (1995-09-01), Hayase
patent: 5448450 (1995-09-01), Burns
patent: 5459335 (1995-10-01), Matsushita et al.
patent: 5463190 (1995-10-01), Carson et al.
patent: 5464154 (1995-11-01), Nielsen
patent: 5489337 (1996-02-01), Nomura et al.
patent: 5489551 (1996-02-01), Castleberry
patent: 5500785 (1996-03-01), Funada
patent: 5518569 (1996-05-01), Achilles et al.
patent: 5529626 (1996-06-01), Stewart
patent: 5579573 (1996-12-01), Baker et al.
patent: 5616206 (1997-04-01), Sakatsu et al.
patent: 5622896 (1997-04-01), Knotter et al.
patent: 5688584 (1997-11-01), Casson et al.
patent: 5707051 (1998-01-01), Tsuji
patent: 5759874 (1998-06-01), Okawa
patent: 5810926 (1998-09-01), Evers
patent: 5840598 (1998-11-01), Grigg et al.
patent: 5874322 (1999-02-01), Evers

Affiliated with

Also associated with

Rating

Method for applying atomized adhesive to a leadframe for chip bo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying atomized adhesive to a leadframe for chip bo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying atomized adhesive to a leadframe for chip bo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-466051