Method for manufacturing electrical contacts for a thin-film sem

Fishing – trapping – and vermin destroying

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437 2, 437 51, 437173, 437180, 437205, 136244, H01L 3118

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active

047834218

ABSTRACT:
A method of fabricating spaced-apart back contacts on a thin film of semiconductor material by forming strips of buffer material on top of the semiconductor material in locations corresponding to the desired dividing lines between back contacts, forming a film of metal substantially covering the semiconductor material and buffer strips, and scribing portions of the metal film overlying the buffer strips with a laser without contacting the underlying semiconductor material to separate the metal layer into a plurality of back contacts. The buffer material serves to protect the underlying semiconductor material from being damaged during the laser scribing. Back contacts and multi-cell photovoltaic modules incorporating such back contacts also are disclosed.

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patent: 4443651 (1984-04-01), Swartz
patent: 4668840 (1987-05-01), Kiyama et al.
patent: 4697041 (1987-09-01), Okaniwa et al.
patent: 4726849 (1988-02-01), Murata et al.

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