Method of enhancing semiconductor wafer release

Details Method of enhancing semiconductor wafer release Method of enhancing semiconductor wafer release

1998-09-28

2000-10-17

Rachuba, M.

Abrading

Abrading process

Glass or stone abrading

451 56, B24B 100

Patent

active

061322946

ABSTRACT:
In accordance with the present invention, a method is disclosed for releasing semiconductor wafers from a polishing pad. The method includes the steps of applying a slurry to a polishing pad, rotating the polishing pad having slurry thereon while applying pressure against a wafer such that the wafer is polished by the slurry, introducing water to the polishing pad, increasing the rotational speed of the polishing pad to remove a portion of the slurry, decreasing the pressure during the step of increasing rotational speed to substantially prevent further polishing and removing the wafer from the polishing pad.

REFERENCES:
patent: 5320706 (1994-06-01), Blackwell
patent: 5779520 (1998-07-01), Hayakawa
patent: 5906532 (1999-05-01), Nakajima et al.
patent: 5913712 (1999-06-01), Molinar

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