Thermal compression bonding method of electronic part with solde

Details Thermal compression bonding method of electronic part with solde Thermal compression bonding method of electronic part with solde

1998-11-06

2000-10-17

Ryan, Patrick

Metal fusion bonding

Process

With condition responsive, program, or timing control

22818021, 2282341, B23K 106, B23K 3102

Patent

active

061317950

ABSTRACT:
A thermal compression bonding method of an electronic part with a solder bump comprises the steps of, pressing the electronic part with the solder bump to a circuit board by a thermal compression bonding tool vertically moving by vertical moving means and thermally compression bonding said electronic part to the circuit board while detecting the pressing force by load detecting means. In this method, there is included the steps of descending the thermal compression bonding tool so as to press the solder bump of said electronic part to the electrode of the circuit board, and judging that the solder bump is melted when a load detected value by said load detecting means is reduced to a value equal to or less than a predetermined value after heating of said electronic part is started so as to ascend the thermal compression bonding tool. Accordingly, it is unnecessary to wait a time-up of a supposed melting time set by a timer in accordance with a conventional method, so that a useless time can be omitted and a productivity can be improved.

REFERENCES:
patent: 5059559 (1991-10-01), Takahashi et al.
patent: 5193732 (1993-03-01), Interrante et al.
patent: 5773889 (1998-06-01), Love et al.
patent: 5849132 (1998-12-01), Chiu
patent: 5984165 (1999-11-01), Inoue et al.

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