Multi-lead hermetic power package with high packing density

Details Multi-lead hermetic power package with high packing density Multi-lead hermetic power package with high packing density

1989-01-30

1990-11-20

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2304

Patent

active

049720430

ABSTRACT:
An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs protruding from opposite corners thereof. The mounting tabs are configured to allow the packages to be nested together. A cover attached to the walls provides a hermetically sealed package.

REFERENCES:
patent: 3206704 (1965-09-01), Hay
patent: 3876926 (1975-08-01), Schott et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4546412 (1985-10-01), Nakazawa et al.
patent: 4636580 (1987-01-01), Neidig et al.
patent: 4713634 (1987-12-01), Yamamura

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