Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing
Patent
1979-04-20
1981-05-26
Smith, Ronald H.
Stock material or miscellaneous articles
Hollow or container type article
Polymer or resin containing
260 28R, 427386, 427421, 427429, 428332, 428413, 428418, 428446, 428457, 528111, 528122, F16L 902, F16L 908
Patent
active
042698790
ABSTRACT:
The invention relates to a low-viscosity, solvent-free epoxy-based coating composition consisting essentially of:
REFERENCES:
patent: 2824078 (1958-02-01), Mellick
patent: 2906720 (1959-09-01), Simpson
patent: 2976256 (1961-03-01), Whittier
patent: 3012487 (1961-12-01), Mika
patent: 3033088 (1962-05-01), Whittenwyler
patent: 3105771 (1963-10-01), Simpson et al.
patent: 3160518 (1964-12-01), Jorda
patent: 3190845 (1965-06-01), Goodnight
patent: 3297056 (1967-01-01), McLaughlin et al.
patent: 3367911 (1968-02-01), Daum et al.
patent: 3374186 (1968-03-01), Steden et al.
patent: 3538184 (1970-11-01), Heer
patent: 3625918 (1971-12-01), Heer et al.
patent: 3629181 (1971-12-01), Heer et al.
patent: 3639344 (1972-02-01), Kinneman et al.
patent: 3654191 (1972-04-01), Habermeier et al.
patent: 3658728 (1972-04-01), Hoffman et al.
patent: 3679465 (1972-07-01), Flynn
patent: 3704229 (1972-11-01), Tashiro et al.
patent: 3713867 (1973-01-01), Parkinson et al.
patent: 3751471 (1973-08-01), Becker
patent: 3755226 (1973-08-01), Christiansen et al.
patent: 3763102 (1973-10-01), Hoffman et al.
patent: 3880789 (1975-04-01), Ishihara et al.
patent: 3917702 (1975-11-01), Hirosawa
Childs S. L.
Smith Ronald H.
The Dampney Company
LandOfFree
Solventless epoxy-based coating composition, method of applying does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solventless epoxy-based coating composition, method of applying , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solventless epoxy-based coating composition, method of applying will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-453794