Process for fabricating thin film and glass sheet laminate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156272, 156289, B29C 1902, B32B 3100

Patent

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041793242

ABSTRACT:
A semiconductor thin film and glass stratum laminate is formed by depositing a semiconductor thin film onto a temporary substrate having a carbon coating to which the film adheres. Processing of the semiconductor thin film for selected performance characteristics is accomplished while the film is affixed to the temporary substrate. The processed thin film is transferred and electrostatically bonded to the glass stratum by exposure to a thermal environment at or below the softening point of the glass stratum and by application of an electric potential across the thin film and glass. The bonded thin film and glass stratum laminate is separated from the temporary substrate.

REFERENCES:
patent: 3397278 (1968-08-01), Pomerantz
patent: 3554832 (1971-01-01), Fischer

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