Method of planarizing an array of plastically deformable contact

Details Method of planarizing an array of plastically deformable contact Method of planarizing an array of plastically deformable contact

1995-07-24

1998-05-05

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29743, 29843, 174260, 228254, 22818022, 361768, H05K 334, H05K 1304

Patent

active

057459860

ABSTRACT:
A method for mounting an integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit on a circuit board. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount.

REFERENCES:
patent: 3833230 (1974-09-01), Noll
patent: 4661192 (1987-04-01), McShane
patent: 5029383 (1991-07-01), Snyder et al.
patent: 5435482 (1995-07-01), Variot et al.
patent: 5465152 (1995-11-01), Bilodeau et al.
patent: 5489750 (1996-02-01), Sakemi et al.

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