1988-07-14
1990-02-06
Clawson, Jr., Joseph E.
357 68, 357 80, H01L 2348, H01L 2310, H01L 2312
Patent
active
048992070
ABSTRACT:
A novel tape-and-semiconductor chip sub-assembly (10) electrically connects bonding pads (not shown) of a semiconductor chip (13) to corresponding leads (26) on a package substrate (12). This tape-and-semiconductor chip sub-assembly includes a thin electrically insulating film, called an inner support ring (18), that has a central aperture (36) for receiving a semiconductor chip (13). The sub-assembly also includes a plurality of conductive fingers (16) on the underside of the film that extend radially inwards beyond the inner ring's inner perimeter for connection to the chip. The fingers also extend radially outward beyond the inner ring's outer perimeter. A novel outer support ring (22) secures the end of each conductive finger in its proper relative position with respect to the other conductive fingers. The outer ring thus facilitates simultaneous alignment during package assembly of all the conductive fingers with the associated substrate leads to which they are respectively to be bonded. It also prevents any of the conductive fingers from curling or sliding during assembly.
REFERENCES:
patent: 3657805 (1972-04-01), Johnson
patent: 4466183 (1984-08-01), Burns
patent: 4672418 (1987-06-01), Moran et al.
"Outer Lead Guard for Tab",-IBM Technical Disclosure Bulletin, vol. 28, No. 5, Oct. 1985, pp. 2257-2238.
Clark S. V.
Clawson Jr. Joseph E.
Digital Equipment Corporation
LandOfFree
Outer lead tape automated bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Outer lead tape automated bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Outer lead tape automated bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-444650