Method of exposing a peripheral part of wafer

Details Method of exposing a peripheral part of wafer Method of exposing a peripheral part of wafer

1988-12-21

1990-02-06

Wintercorn, Richard A.

Photocopying

Projection printing and copying cameras

Methods

355 40, 355 53, 355 1, G03B 2732

Patent

active

048991953

ABSTRACT:
A method of exposing a peripheral part of wafer is used for a fine pattern formation process in the processing of ICs, LSIs and other electronics elements, to remove, in a development step, an unncessary portion of a photoresist coated on a semiconductor substrate, typically a silicon wafer, or a substrate consisting of a dielectric, a metal or an insulator, from a peripheral part of the substrate.
In the method for exposing a peripheral part of wafer, the wafer edge is detected using a sensor, and the light emission end of an optical fiber lightguide is controlled to expose a fixed distance from the edge of wafer according to a signal from the sensor. It is thus possible to expose a peripheral part of wafer having a predetermined width with high accuracy. In addition, the wafer centering mechanism and orientation flat detection/positioning mechanism employed in the prior art are unncessary. It is thus possible to provide a method exposing a peripheral part of wafer which can greatly reduce the processing time and has extremely high accuracy and efficiency.

REFERENCES:
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patent: 3836246 (1974-09-01), Bowker
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patent: 4477182 (1984-10-01), Takanashi et al.
Patent Abstracts of Japan, vol. 7, No. 256, (P-236) [1401], Nov. 1983.
Patent Abstracts of Japan, vol. 9, No. 193, (E-334) [1916], Aug. 1985.
Patent Abstracts of Japan, vol. 8, No. 268, (E-283) [1705], Dec. 1984.
Patent Abstracts of Japan, vol. 7, No. 190 (E-194) [1335], Aug. 1983.

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