Method for handling semiconductor components

Details Method for handling semiconductor components Method for handling semiconductor components

1989-03-06

1990-03-06

Spar, Robert J.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

53410, 53472, 414403, B65G 300

Patent

active

049061623

ABSTRACT:
A method for handling semiconductor components by utilizing a removable filler strip for temporarily securing or clinching longitudinally arrangeable individual components in a tube, rod or hollow magazine. The filler strip is generally flat, but has surface features that serve to press the components against the top, bottom or side of the tube. Partial removal of the filler strip will result in the dispensing of some of the components while the remainder are retained by the filler strip in the tube.

REFERENCES:
patent: 4515269 (1985-05-01), Hashimoto
patent: 4592481 (1986-06-01), Chen
patent: 4635794 (1987-01-01), Lemmer
patent: 4655364 (1987-04-01), Swapp et al.
patent: 4767004 (1988-08-01), Ishihara et al.

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