Three-dimensional multi-chip module

Details Three-dimensional multi-chip module Three-dimensional multi-chip module

1992-07-21

1994-03-22

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 257713, 361719, 361764, 439 76, H05K 720

Patent

active

052970060

ABSTRACT:
A three-dimensional multi-chip module having high integration density and a high power output. The module includes a substrate having wiring patterns thereon and a plurality of electrode terminals. At least one semiconductor element is arranged facedown on a bottom surface of the substrate and is operatively connected to the electrode terminals. At least one semiconductor element or passive element is arranged on the front surface of the substrate and is operatively connected to the electrode terminals. A heat conductive base is disposed so as to face the bottom surface of the substrate and the base is in thermal contact with the back surface of the semiconductor element arranged on the bottom surface of the substrate. A support base and a cap are provided so that the heat conductive base, the support base and the cap form an enclosure for the substrate.

REFERENCES:
patent: 4654694 (1987-03-01), Val
patent: 4703339 (1987-10-01), Matsuo
IBM Tech Discl Bull vol. 21, No. 3 Aug. 1978, p. 1064, "Ceramic Cup . . . Package", Durand et al.
IBM Tech Discl Bull Vol. 21 No. 1 Jun. 1978, p. 183, "Packaging Structure", Blake et al.
IBM Tech Discl Bull Vol. 21 No. 1 Jun. 1978, p. 99, "Circuit Chip . . . Bond", Coombs et al.
IBM Tech Discl Bull vol. 21 No. 2 Jul. 1978, p. 585, "High Performance . . . Memory", Doo et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984, New York p. 4226, R. A. Cicone et al. `Silicon integrated high performance package`.

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