Electroplating apparatus for plate-shaped workpieces

Details Electroplating apparatus for plate-shaped workpieces Electroplating apparatus for plate-shaped workpieces

1989-06-26

1990-02-06

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204202, C25D 1700

Patent

active

048986577

ABSTRACT:
An electroplating apparatus, which has the workpieces, such as printed circuit boards, being conducted through an electrolyte solution in a horizontal path, has cathodic contacting by contact clamps, which move with the workpiece through the device. In order to guarantee a reliable supply of cathode current with a low thermal heating and a low wear of the contacts, which are also simultaneously resistant to the corrosion of the conducting parts, a live rail is provided that comprises a core composed of a material of high electrical conductivity, such as copper, and is covered by an envelope composed of a material having a high resistance to corrosion, such as titanium. Contact springs, preferably composed of titanium, are connected to the live rail in a mechanical and electrical conductive fashion, such as by spot welding, and engage each of the contact clamps as they move along the path.

REFERENCES:
patent: 4752371 (1988-06-01), Kreisel et al.
patent: 4755271 (1988-07-01), Hosten

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