Method for providing a strengthened conductive circuit pattern

Details Method for providing a strengthened conductive circuit pattern Method for providing a strengthened conductive circuit pattern

1988-11-15

1990-02-06

Lawrence, Evan

Chemistry: electrical and wave energy

Processes and products

427 531, 427 98, 427264, 427265, 427306, C25D 502, B05D 306, B05D 310, B05D 512

Patent

active

048986488

ABSTRACT:
A method for providing a circuit pattern on an insulated substrate that has improved adherence thereto. By providing an electroless conductive layer of a predetermined thickness on the substrate and thereafter exposing the substrate to an ablative laser beam, the resultant conductive lines are stronger than those provided by previously known techniques.

REFERENCES:
patent: 4659587 (1987-04-01), Imura et al.
patent: 4661213 (1987-04-01), Dorsett et al.
patent: 4681774 (1987-07-01), Halliwell et al.

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