Method of making an electrical circuit package

Details Method of making an electrical circuit package Method of making an electrical circuit package

1986-04-07

1987-06-30

Echols, Percy W.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29832, 29847, 26427215, 26427216, 26427217, H01H 1104

Patent

active

046759891

ABSTRACT:
An electrical circuit package comprises a stamped and formed lead frame to which is molded a dielectric housing member which includes openings having exposed electrical contacts, the housing member providing support for the lead frame. Some of the exposed contacts in the openings serve to support electrical components in the openings and to make electrical contact therewith while other of the exposed contacts in the openings electrically engage the electrical components and maintain them in the openings. Further exposed contacts electrically engage another electrical component and the housing member and the further exposed contacts maintain the other electrical component in the housing member. An electrical switch is part of the lead frame. The method involves molding a dielectric housing member on the lead frame with exposed circuit path parts in openings either stamped into pairs before molding or severed into pairs after molding, and further forming ones of the pairs of exposed path parts into cantilever contact members while the others of the pairs define stationary contact members.

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