Solder-coated printed circuit board and method of manufacturing

Details Solder-coated printed circuit board and method of manufacturing Solder-coated printed circuit board and method of manufacturing

1992-03-17

1994-03-22

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, 174260, 2281801, 361771, H05K 0100

Patent

active

052966496

ABSTRACT:
A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H<W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W>D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

REFERENCES:
patent: 3986255 (1976-10-01), Mandal
patent: 4081601 (1978-03-01), Dinella et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5118029 (1992-06-01), Fuse et al.
patent: 5118386 (1992-06-01), Kataoka et al.
patent: 5145532 (1992-08-01), Fukunaga et al.
Technische Rundschau, vol. 79, No. 34, Aug. 21, 1987, Berb, Schweiz; pp. 62-72, Wittwer et al.; SMI: Keineswegs Nur fur Grosse.
IBM Technical Disclosure Bulletin, vol. 29, No. 9, Feb. 1987; Armonk, N.Y.; "Surface Solder Mounting Pad Geometry"; pp. 4047-4048.
Third IEEE/CHMT International Electronic Manufacturing Technology Symposium: "Manufacturing Technology-The Competitive Advantage"; Oct. 12, 1987; CA. pp. 12-15; Mizutani et al.
Patent Abstracts of Japan; vol. 15, No. 183; May 10, 1991 & JP-A-30 44 994 Feb. 26, 1991.

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