Polishing apparatus

Details Polishing apparatus Polishing apparatus

1987-08-18

1990-02-06

Rose, Robert

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

511315, 51237R, B24B 3704

Patent

active

048979660

ABSTRACT:
An apparatus for polishing one of opposite faces of a slab member includes a surface plate, a mounting member, an urging shaft and a pressure transmitting member. The surface plate has a flat upper surface and is rotatable about an axis perpendicular to the upper surface. The mounting member has an upper face and a lower face to which the other face of the slab member is fixedly secured, and is disposed above the surface plate in such a manner that the one face of the slab member to be polished is held in contact with the upper surface of the surface plate. The urging shaft is connected to the mounting member for urging the mounting member toward the surface plate at a prescribed urging pressure to bring the one face of the slab member into pressure contact with the upper surface of the surface plate. The pressure transmitting member is interposed between the mounting member and the urging shaft for causing the urging pressure of the urging shaft to exert on the upper face of the mounting member. The transmitting member has a deformable chamber which contains a fluid therein.

REFERENCES:
patent: 2441108 (1948-05-01), Turner
patent: 3579917 (1971-05-01), Boettcher
patent: 3740900 (1973-02-01), Youmans et al.
patent: 3849948 (1974-04-01), Youmans et al.
A. C. Bonora, "Flex-Mount Polishing of Silicon Wafers", Solid State Technology, Oct. 1977, pp. 55-58.
Patent Abstracts of Japan, vol. 1, No. 68, 4th Jul. 1977, p. 1023 M 77.

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