Thermosetting compositions and molding method

Details Thermosetting compositions and molding method Thermosetting compositions and molding method

1989-09-05

1991-07-23

Page, Thurman

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

502156, 502172, C08G 804, C08G 1402

Patent

active

050344978

ABSTRACT:
A thermosetting resin containing composition can be heated to reduce its viscosity and used as a liquid in a liquid injection molding method. It has a phenolic resin content of about 80% to about 90% solids by weight, and contains about 5% to about 40% of a polyglycol. The composition may also contain resorcinol as a compatibilizing agent and a polyalkylene glycol as the polyglycol agent. In a novel method the resin containing composition is heated to reduce its viscosity and introduced into a heated mold in a liquid injection molding method.

REFERENCES:
patent: 4358570 (1982-11-01), Tobinaga
patent: 4661412 (1987-04-01), Bornstein et al.

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