Contact having spring portion with smaller thickness contacting

Details Contact having spring portion with smaller thickness contacting Contact having spring portion with smaller thickness contacting

1992-11-12

1994-03-22

Vo, Peter Dungba

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439886, 29876, H01R 909, H01R 1324

Patent

active

052958400

ABSTRACT:
An insulating layer is formed on at least one side surface of a spring portion of a contact, and a contacting portion formed on the spring portion is made narrower than the thickness of the spring portion, and a contacting surface of the contacting portion spaced from an edge portion of the insulating layer inwardly of the side surfaces of the spring portion.

REFERENCES:
patent: 4593463 (1986-06-01), Kamono et al.
patent: 4665614 (1987-05-01), Stipanuk et al.
patent: 4780093 (1988-10-01), Walse et al.
patent: 4846704 (1989-07-01), Ikeya
patent: 4921430 (1990-05-01), Matsuoka
patent: 4927368 (1990-05-01), Shino

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