Method of fabricating a bump electrode for an integrated circuit

Details Method of fabricating a bump electrode for an integrated circuit Method of fabricating a bump electrode for an integrated circuit

1990-08-01

1991-07-23

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437190, 437245, H01L 21441

Patent

active

050343459

ABSTRACT:
A bump electrode for connecting a semiconductor device with an external lead is disclosed. The bump electrode is designed to eliminate mechanical stress caused by molten metal flowing onto the semiconductor chip during manufacture. The bump electrode metal is formed over an upper and lower foundation film. The lower foundation film extends out laterally beyond the upper foundation film and the bump electrode metal. The lower foundation film does not get wet with the flowing molten metal, and, therefore, prevents the molten metal from flowing onto the chip.

REFERENCES:
patent: 4113578 (1978-09-01), Del Monte
patent: 4427715 (1984-01-01), Harris

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