Method of fabricating a monolithic integrated circuit chip for a

Details Method of fabricating a monolithic integrated circuit chip for a Method of fabricating a monolithic integrated circuit chip for a

1991-01-02

1991-12-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 60, 437918, 437 47, 148DIG136, H04L 2170

Patent

active

050752502

ABSTRACT:
A thermal jet ink printing is provided with an improved printhead. The printhead is formed by monolithic integration of MOS logic elements and drivers onto the same silicon substrate containing the resistive elements using a more efficient manufacturing process. In a preferred embodiment, the logic switches, logic drivers and resistive elements are formed from a single layer of polysilicon with the resistive element formed on a thermally grown field oxide layer. The integrated circuit chips are formed by a MOS fabrication technology which uses fewer processing steps than used in existing chips, and the resulting chips are thermally stable and can be operated at higher logic voltages.

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patent: 4602421 (1986-07-01), Lee et al.
patent: 4947192 (1990-08-01), Hawkins et al.
patent: 5013677 (1991-05-01), Hozumi

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