Heat sink assembly having a clip

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S707000, C361S709000, C361S719000, C165S080300, C165S185000

Reexamination Certificate

active

08081477

ABSTRACT:
A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink, two arms extending slantwise and upwardly from opposite ends of the pressing portion, two connecting portions extending outwardly from the two arms, two securing portions engaging with the printed circuit board, and two operating portions. When the two operating portion are operated, the connecting portions are rotated and the securing portions rotate with the connecting portions to engage with the printed circuit board.

REFERENCES:
patent: 6510054 (2003-01-01), Chen
patent: 6822869 (2004-11-01), Huang et al.
patent: 7203066 (2007-04-01), Lee et al.
patent: 7382622 (2008-06-01), Li et al.
patent: 2003/0015343 (2003-01-01), Chen
patent: 2010/0002396 (2010-01-01), He et al.

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