Semiconductor package with a controlled impedance bus and...

Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead – On integrated circuit

Reexamination Certificate

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Reexamination Certificate

active

08076759

ABSTRACT:
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.

REFERENCES:
patent: 4636982 (1987-01-01), Takemae et al.
patent: 4766538 (1988-08-01), Miyoshi
patent: 4985867 (1991-01-01), Ishii et al.
patent: 5222047 (1993-06-01), Matsuda et al.
patent: 5307469 (1994-04-01), Mann
patent: 5334962 (1994-08-01), Higgins et al.
patent: 5394528 (1995-02-01), Kobayashi et al.
patent: 5530814 (1996-06-01), Wong et al.
patent: 5559970 (1996-09-01), Sharma
patent: 5614855 (1997-03-01), Lee et al.
patent: 5630106 (1997-05-01), Ishibashi
patent: 5652870 (1997-07-01), Yamasaki et al.
patent: 5655113 (1997-08-01), Leung et al.
patent: 5717871 (1998-02-01), Hsieh et al.
patent: 5717901 (1998-02-01), Sung et al.
patent: 5764590 (1998-06-01), Iwamoto et al.
patent: 5787267 (1998-07-01), Leung et al.
patent: 5793998 (1998-08-01), Copeland et al.
patent: 5798998 (1998-08-01), Fukushima et al.
patent: 5801985 (1998-09-01), Roohparvar et al.
patent: 5808947 (1998-09-01), McClure
patent: 5831925 (1998-11-01), Brown et al.
patent: 5852725 (1998-12-01), Yen
patent: 5893927 (1999-04-01), Hovis
patent: 5897193 (1999-04-01), Nishino
patent: 5933387 (1999-08-01), Worley
patent: 5958033 (1999-09-01), Schubert et al.
patent: 5995379 (1999-11-01), Kyougoku et al.
patent: 6034878 (2000-03-01), Osaka et al.
patent: 6038132 (2000-03-01), Tokunaga et al.
patent: 6047347 (2000-04-01), Hansen et al.
patent: 6064585 (2000-05-01), Mori et al.
patent: 6125157 (2000-09-01), Donnelly et al.
patent: 6138185 (2000-10-01), Nelson et al.
patent: 6141273 (2000-10-01), Ku et al.
patent: 6144220 (2000-11-01), Young
patent: 6144576 (2000-11-01), Leddige et al.
patent: 6175124 (2001-01-01), Cole et al.
patent: 6188595 (2001-02-01), Chevallier
patent: 6191998 (2001-02-01), Reddy et al.
patent: 6214645 (2001-04-01), Kim
patent: 6219785 (2001-04-01), Smith
patent: 6240039 (2001-05-01), Lee et al.
patent: RE37409 (2001-10-01), Barth et al.
patent: 6307256 (2001-10-01), Chiang et al.
patent: 6307769 (2001-10-01), Nuxoll et al.
patent: 6311313 (2001-10-01), Camporese et al.
patent: 6404660 (2002-06-01), Gamini et al.
patent: 6496400 (2002-12-01), Chevallier
patent: 6594818 (2003-07-01), Kim et al.
patent: 6889304 (2005-05-01), Perego et al.
patent: 7626248 (2009-12-01), Gamini et al.
patent: 2001/0016369 (2001-08-01), Zandman et al.
patent: 2004/0019756 (2004-01-01), Perego et al.
patent: 2004/0221106 (2004-11-01), Perego et al.
patent: 887737 (1998-12-01), None
patent: WO 91/16680 (1991-10-01), None
Kirihata, T., et al., “A 390-mm2, 16-Bank, 1-Gb DDR SDRAM with Hybrid Bitline Architecture,” IEEE Journal of Solid-State Circuits, vol. 34, No. 11, Nov. 1999, pp. 1580-1588.
John, L.K., “VaWiRAM: A Variable Width Random Access Memory Module,” 1995 IEEE, 9th International Conference on VLSI Design—1996. pp. 219-224.
Satoh, K. et al., “A 209K-Transistor ECL Gate Array with RAM,” IEEE Journal of Solid-State Circuits, vol. 24, No. 5, Oct. 1989, pp. 1275-1281.
Masumoto, R.T., “Configurable On-Chip RAM Incorporated Into High Speed Logic Array,” Proceedings of the IEEE 1985 Custom Integrated Circuits Conference, May 20-23, 1985, pp. 240-243.
Rynearson, J., “VMEbus Daisy Chains,” Reprinted from the VITA Journal. Originally writtten in Mar. 1997, last pg. of article updated Sep. 15, 1999, 2 pgs.
Minutes of Meeting No. 70, JC-42.3 Committee on RAM Memories, Mar. 9, 1994, Orlando, Florida, 72 pages (see, in particular, p. 62).
Microsoft Computer Dictionary, Copyright 1999, Fourth Edition, p. 145.

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