Electronic device mounting structure

Details Electronic device mounting structure Electronic device mounting structure

2008-09-11

2011-12-13

Datskovskiy, Michail V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S715000, C361S719000, C361S679540, C165S080300, C165S185000, C174S016300, C174S252000, C257S678000, C257S686000, C257S706000, C257S718000

Reexamination Certificate

active

08077476

ABSTRACT:
An electronic device mounting structure includes a thermally conductive base, a busbar located on the base, an electronic device mounted on the busbar, a thermally conductive wall standing on the base and having first and second portions located opposite each other across the electronic device, and a plate spring supported by the first and second portions of the wall. The plate spring presses the electronic device against the base so that thermal resistance between the electronic device and the base is reduced. The plate spring has a thermal conductivity so that heat in the electronic device is transferred to the wall through the plate spring.

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Japanese Office Action dated Jul. 21, 2009, issued in corresponding Japanese Application No. 2007-237168, with English translation.

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