Method and apparatus for performing wire bonding by using solder

Details Method and apparatus for performing wire bonding by using solder Method and apparatus for performing wire bonding by using solder

1993-05-20

1994-03-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228220, 228 45, 228 42, H01L 21603

Patent

active

052956199

ABSTRACT:
A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.

REFERENCES:
patent: 4732313 (1988-03-01), Kobayashi et al.
patent: 4875618 (1989-10-01), Hasegawa et al.
patent: 4976393 (1990-12-01), Nakajima et al.

Affiliated with

Also associated with

Rating

Method and apparatus for performing wire bonding by using solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for performing wire bonding by using solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for performing wire bonding by using solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-431430