Method for manufacturing hybrid printed circuit board

Details Method for manufacturing hybrid printed circuit board Method for manufacturing hybrid printed circuit board

2008-03-12

2011-11-22

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S840000, C257S680000, C438S106000

Reexamination Certificate

active

08061022

ABSTRACT:
A method for manufacturing a hybrid printed circuit board having two kinds of wiring boards. The circuit board has method has a first wiring board having a first terminal and, a second wiring board wherein a dent wherein the first wiring board is fitted and equipped with a second terminal is formed, and forming the same plane as the first wiring board. The board also has an insulating adhesive material disposed around the first terminal, and a conductive adhesive joining the first terminal with the second terminal.

REFERENCES:
patent: 5801446 (1998-09-01), DiStefano et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6687985 (2004-02-01), Sakamoto et al.
patent: 2004/0183193 (2004-09-01), Koide et al.
patent: 2005/0266213 (2005-12-01), Kanda et al.
patent: 2000-332057 (2000-11-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing hybrid printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing hybrid printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing hybrid printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4311991