Monitoring and repair method for adhesive bonding

Details Monitoring and repair method for adhesive bonding Monitoring and repair method for adhesive bonding

2007-11-30

2011-11-08

Ralis, Stephen (Department: 3742)

Electric heating

Metal heating

For bonding with pressure

C219S091200, C219S091210, C219S091220

Reexamination Certificate

active

08053698

ABSTRACT:
A method for monitoring the presence of an adhesive between two metal workpieces includes measuring the depth of indentation made by electric resistance weld electrodes by measuring the advance of the weld electrodes, and comparing the measured depth of indentation with the depth of indentation that is known to occur when the presence of the adhesive between the metal workpieces minimizes the shunting of weld current and thereby affects the depth of indentation. If the adhesive is absent, a supplemental electric resistance weld is made to compensate for the absent adhesive. The invention is applicable to both adhesive bonding, where only adhesive is used to attach the workpieces, and weldbonding, where an electric resistance weld is made atop a layer of adhesive.

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