Semiconductor wafer holder and electroplating system for...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

08075756

ABSTRACT:
A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

REFERENCES:
patent: 2341712 (1944-02-01), Gray
patent: 3623962 (1971-11-01), Beale
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5092975 (1992-03-01), Yamamura et al.
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5312532 (1994-05-01), Andricacos et al.
patent: 5316642 (1994-05-01), Young et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5843296 (1998-12-01), Greenspan
patent: 6074544 (2000-06-01), Reid et al.
patent: 6099702 (2000-08-01), Reid et al.
patent: 6113764 (2000-09-01), Emch
patent: 6113769 (2000-09-01), Uzoh et al.
patent: 6129100 (2000-10-01), Kitagawa et al.
patent: 6139712 (2000-10-01), Patton et al.
patent: 6174123 (2001-01-01), Marttila
patent: 6203582 (2001-03-01), Berner et al.
patent: 6248222 (2001-06-01), Wang
patent: 6254760 (2001-07-01), Shen et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6258244 (2001-07-01), Ohmi et al.
patent: 6294059 (2001-09-01), Hongo et al.
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6309524 (2001-10-01), Woodruff et al.
patent: 6391209 (2002-05-01), Belongia et al.
patent: 6454918 (2002-09-01), Sakaki
patent: 6517689 (2003-02-01), Hongo et al.
patent: 6645355 (2003-11-01), Hanson et al.
patent: 7402227 (2008-07-01), Yoshioka et al.
patent: 58-181898 (1983-10-01), None
patent: 60-99531 (1985-07-01), None
patent: 63-028900 (1988-02-01), None
patent: 64-10073 (1989-01-01), None
patent: 1-116094 (1989-05-01), None
patent: 1-104035 (1989-07-01), None
patent: 5-206348 (1993-08-01), None
patent: 05-222590 (1993-08-01), None
patent: 5-247692 (1993-09-01), None
patent: 6-108285 (1994-04-01), None
patent: 6-310461 (1994-11-01), None
patent: 6-334087 (1994-12-01), None
patent: 7-292498 (1995-11-01), None
patent: 8-134699 (1996-05-01), None
patent: 11-2000096 (1996-07-01), None
patent: 8-253891 (1996-10-01), None
patent: 9-59795 (1997-03-01), None
patent: 10-25598 (1998-01-01), None
patent: 10-233400 (1998-09-01), None
patent: 10-287978 (1998-10-01), None
patent: 11-140694 (1999-05-01), None
patent: 11-152597 (1999-06-01), None
patent: 11-152600 (1999-06-01), None
patent: 11-172492 (1999-06-01), None
patent: 11-195622 (1999-07-01), None
Journal Ebara, vol. 181 (Oct. 1998), “Summary of the Plating Apparatus”, pp. 42-49 (with English translation).
Supplementary European Search Report dated May 15, 2006 in European Application No. 99 91 9638.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor wafer holder and electroplating system for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer holder and electroplating system for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer holder and electroplating system for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4310046

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.