Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-03-15
2011-12-13
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S790000, C361S795000, C174S260000, C174S261000, C174S262000
Reexamination Certificate
active
08077478
ABSTRACT:
A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.
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Search report from E.P.O., mail date is Nov. 22, 2010.
English Language Abstract of JP 2003-86733, Mar. 20, 2003.
English Language Abstract of JP 2000-68440, Mar. 3, 2000.
Partial English language translation of JP 2003-086733, Mar. 20, 2003.
English language Abstract of JP 10-104322, Apr. 24, 1998.
English language Abstract of JP 10-012809, Jan. 16, 1998.
English language Abstract of JP 2005-026573, Jan. 27, 2005.
English language Abstract of JP 63-265451, Nov. 1, 1988.
English language Abstract of JP 10-189815, Jul. 21, 1998.
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Ishimaru Yukihiro
Takatori Masahiro
Chervinsky Boris
Greenblum & Bernstein P.L.C.
Panasonic Corporation
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