Module board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S760000, C361S790000, C361S795000, C174S260000, C174S261000, C174S262000

Reexamination Certificate

active

08077478

ABSTRACT:
A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.

REFERENCES:
patent: 5200362 (1993-04-01), Lin et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5661647 (1997-08-01), Washburn et al.
patent: 5754410 (1998-05-01), Bardsley et al.
patent: 5963430 (1999-10-01), Londa
patent: 6094056 (2000-07-01), Bardsley et al.
patent: 6285559 (2001-09-01), Fukiharu
patent: 6483718 (2002-11-01), Hashimoto
patent: 6628527 (2003-09-01), Muramatsu et al.
patent: 6890798 (2005-05-01), McMahon
patent: 6989600 (2006-01-01), Kubo et al.
patent: 7161371 (2007-01-01), Higashitani et al.
patent: 7354800 (2008-04-01), Carson
patent: 7485489 (2009-02-01), Bjorbell
patent: 2003/0148558 (2003-08-01), Kubo et al.
patent: 2003/0159852 (2003-08-01), Nakamura
patent: 2004/0063340 (2004-04-01), Nakamura
patent: 2004/0066634 (2004-04-01), Nakamura
patent: 2005/0246891 (2005-11-01), Nakamura
patent: 2006/0191715 (2006-08-01), Koyama et al.
patent: 2007/0148829 (2007-06-01), Yoshino et al.
patent: 63-265451 (1988-11-01), None
patent: 6-077398 (1994-03-01), None
patent: 10-012809 (1998-01-01), None
patent: 10-104322 (1998-04-01), None
patent: 10-189815 (1998-07-01), None
patent: 2000-068440 (2000-03-01), None
patent: 2000 68440 (2000-03-01), None
patent: 2003-086733 (2003-03-01), None
patent: 2003 86733 (2003-03-01), None
patent: 2005-026573 (2005-01-01), None
patent: 01/82367 (2001-11-01), None
patent: 01 82367 (2001-11-01), None
Search report from E.P.O., mail date is Nov. 22, 2010.
English Language Abstract of JP 2003-86733, Mar. 20, 2003.
English Language Abstract of JP 2000-68440, Mar. 3, 2000.
Partial English language translation of JP 2003-086733, Mar. 20, 2003.
English language Abstract of JP 10-104322, Apr. 24, 1998.
English language Abstract of JP 10-012809, Jan. 16, 1998.
English language Abstract of JP 2005-026573, Jan. 27, 2005.
English language Abstract of JP 63-265451, Nov. 1, 1988.
English language Abstract of JP 10-189815, Jul. 21, 1998.
English language Abstract of JP 6-077398, Mar. 18, 1994.

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