Semiconductor device and a method for manufacturing the same

Details Semiconductor device and a method for manufacturing the same Semiconductor device and a method for manufacturing the same

2009-05-20

2011-12-06

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S762000, C257SE23068, C257SE23070, C257SE23072, C257SE21158, C438S652000

Reexamination Certificate

active

08072068

ABSTRACT:
A semiconductor device according to the present invention includes: a semiconductor chip; a sealing resin layer formed on the semiconductor chip; and a post electrode formed in a through-hole penetrating through the sealing resin layer in a thickness direction, and having a hemispheric top surface.

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patent: 2008/0128917 (2008-06-01), Yamano
patent: 2003-031768 (2003-01-01), None

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