Semiconductor module and mobile apparatus

Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin

Reexamination Certificate

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Reexamination Certificate

active

08063846

ABSTRACT:
A semiconductor module includes a multilayer board, a first circuit element mounted on the multilayer board, a second circuit element stacked on the first circuit element, an interposer board, provided between the first circuit element and the second circuit element, which includes an antenna conductor, a passive element, mounted on the multilayer board, which is connected to the antenna conductor, and a molded resin layer which seals the respective elements. The antenna conductor is structured by a spiral-shaped wiring pattern and the both ends of the antenna conductor are connected to the passive element via a bonding wire. The antenna conductor functions as a loop antenna with the passive element inserted.

REFERENCES:
patent: 7084465 (2006-08-01), Shibata et al.
patent: 7369086 (2008-05-01), Luen
patent: 7592968 (2009-09-01), Modro
patent: 2004/0079999 (2004-04-01), Shibata et al.
patent: 2004/0235519 (2004-11-01), Frielink et al.
patent: 2006/0038176 (2006-02-01), Akimoto et al.
patent: 2006/0119344 (2006-06-01), Benke et al.
patent: 2006/0237831 (2006-10-01), Danno et al.
patent: 2002-271088 (2002-09-01), None
patent: 2004-111656 (2004-04-01), None

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