Light emitting device and method of manufacturing the light...

Details Light emitting device and method of manufacturing the light... Light emitting device and method of manufacturing the light...

2010-07-28

2011-12-20

Ahmadi, Mohsen (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Making emissive array

C438S046000, C438S069000, C438S082000, C438S099000, C438S110000, C257SE21002, C257SE21299, C257SE21527

Reexamination Certificate

active

08080436

ABSTRACT:
A method of manufacturing a light emitting device includes: a first step of forming on a supporting substrate made of a stainless steel, a plurality of conductive members each including a first region containing Au and a second region containing a metallic member having a diffusion coefficient with respect to a metal in the stainless steel smaller than a diffusion coefficient of Au with respect to the metal in the stainless steel, a second step of forming a base member made of a light-blocking resin on the supporting substrate between the conductive members, a third step of bonding a light emitting element on an upper surface of a conductive member through an adhesive member, a fourth step of covering the light emitting element with an optically transmissive sealing member, and a fifth step of removing the supporting substrate and individually separating the light emitting devices.

REFERENCES:
patent: 2004/0214363 (2004-10-01), Matsubara et al.
patent: 2005/0045903 (2005-03-01), Abe et al.
patent: 2005/0082561 (2005-04-01), Suehiro et al.
patent: 2006/0202220 (2006-09-01), Hayashi
patent: 2008/0149960 (2008-06-01), Amo et al.
patent: 2010/0155739 (2010-06-01), Kuramoto et al.
patent: 2005-079329 (2005-03-01), None
patent: 2006-156704 (2006-06-01), None
patent: WO-2007/015426 (2007-02-01), None

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