Memory modules including compliant multilayered...

Details Memory modules including compliant multilayered... Memory modules including compliant multilayered...

2009-06-17

2011-12-20

Smith, Courtney (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S709000, C165S185000, C257S713000, C428S040100, C428S323000, C428S408000

Reexamination Certificate

active

08081468

ABSTRACT:
According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.

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Office Action dated Nov. 2, 2010, issued by the United States Patent and Trademark Office for U.S. Appl. No. 12/486,456, 11 pages.
Office Action from pending U.S. Appl. No. 12/486,456 (now published as US2010/0321897) which names the same inventors as the instant application but is not related through a priority claim; dated Feb. 23, 2011; 15 pages.

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