Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2008-03-04
2011-12-27
Kackar, Ram N. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345250, C156S345340, C118S715000, C118S712000
Reexamination Certificate
active
08083888
ABSTRACT:
The invention provides a plasma processing apparatus for measuring the etching quantity of the material being processed and detecting the end point of etching using optical interference on the surface of a sample being processed, so as to simultaneously realize long life and ensure sufficient light to be received via a light transmitting unit, to enable long term stable operation and to improve the processing accuracy via accurate etching quantity detection. In a plasma processing apparatus for processing a sample being processed by generating plasma between a shower plate and a lower electrode, a detector for detecting light from a surface of the sample being processed via the shower plate includes a light transmitting unit composed of a light guide into which light is entered and a spectroscope for analyzing the light obtained by the light transmitting unit, wherein the end surface of the light transmitting unit through which light is entered is arranged at a distance of five times or greater of the mean free path of gas molecules within the vacuum reactor from the end surface of the shower plate facing the plasma.
REFERENCES:
patent: 6755932 (2004-06-01), Masuda et al.
patent: 6758941 (2004-07-01), Ookawa et al.
patent: 2005/0092435 (2005-05-01), Hayashi et al.
patent: 2005/0189069 (2005-09-01), Ludviksson et al.
patent: 2006/0191484 (2006-08-01), Mitrovic et al.
patent: 2007/0131354 (2007-06-01), Yokogawa et al.
patent: 2002-184766 (2002-06-01), None
patent: 3643540 (2005-02-01), None
patent: 2007-165512 (2007-06-01), None
Matsumoto Tsuyoshi
Muto Satoru
Usui Tatehito
Yokogawa Ken'etsu
Yoshida Tsuyoshi
Antonelli, Terry Stout & Kraus, LLP.
Hitachi High-Technologies Corporation
Kackar Ram N.
LandOfFree
Plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4305046