Silicone encapsulated devices

Details Silicone encapsulated devices Silicone encapsulated devices

1984-05-29

1986-01-14

Marquis, Melvyn I.

Stock material or miscellaneous articles

Composite

Of silicon containing

174110S, 427 96, 528 32, 528 34, 528 38, 528901, B32B 904

Patent

active

045645620

ABSTRACT:
An article of manufacture comprises an electronic device having a silicone resin encapsulant thereover, wherein the silicone resin is an oxime and water free formulation derived from curing a mixture consisting essentially of a heat curable silicone elastomer prepolymer and a dialkylaminoalkoxysilane. The mixture may also contain fillers and a small amount of curing catalyst and stabilizer.

REFERENCES:
patent: 3674738 (1942-07-01), Nitzsche et al.
patent: 3678003 (1972-07-01), Kaiser et al.
patent: 3686357 (1972-08-01), Cheeseman
patent: 3702769 (1972-11-01), Vaughn
patent: 3923736 (1975-12-01), Nitzsche et al.
patent: 3983265 (1976-09-01), Letoffe
patent: 4036813 (1977-07-01), Hardman et al.
patent: 4219607 (1980-08-01), Cammack, II et al.
patent: 4248993 (1981-02-01), Takago
patent: 4318939 (1982-03-01), Wong
patent: 4431472 (1984-02-01), Hohl et al.

Affiliated with

Also associated with

Rating

Silicone encapsulated devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicone encapsulated devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicone encapsulated devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-430454