Heat treatment apparatus for semiconductor wafers

Details Heat treatment apparatus for semiconductor wafers Heat treatment apparatus for semiconductor wafers

1995-05-26

1999-03-02

Walberg, Teresa J.

Electric resistance heating devices

Heating devices

Radiant heater

219390, 118725, 118 501, C23L 1600

Patent

active

058781919

ABSTRACT:
A heat treatment apparatus for semiconductor wafers includes a reaction chamber, a heater, a heat-insulating member, a first cooling gas path, a second cooling gas path, a blower and a controller. The reaction chamber houses semiconductor wafers. The heater is provided outside the reaction chamber to heat it. The heat-insulating member is provided outside the heater to keep the temperature of the reaction chamber. The first cooling gas path is interposed between the reaction chamber and heater, while the second cooling gas path is disposed between the heater and heat-insulating member. The blower allows gas to flow through the first and second gas paths to cool the reaction chamber. The controller controls the heater to increase the temperature of the reaction chamber and does the blower to decrease the temperature thereof.

REFERENCES:
patent: 4195820 (1980-04-01), Berg
patent: 4882468 (1989-11-01), Bouchon
patent: 4883424 (1989-11-01), Sakai et al.
patent: 5053247 (1991-10-01), Moore
patent: 5097890 (1992-03-01), Nakao
patent: 5207835 (1993-05-01), Moore
patent: 5239614 (1993-08-01), Ueno et al.
patent: 5346555 (1994-09-01), Nunotani et al.
patent: 5360336 (1994-11-01), Monoe
patent: 5507639 (1996-04-01), Monoe

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