Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – With pn junction isolation
Reexamination Certificate
2009-01-23
2011-11-01
Stark, Jarrett (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
With pn junction isolation
C257S517000, C257S525000, C257S557000, C257S575000, C257SE51004
Reexamination Certificate
active
08049307
ABSTRACT:
Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices are presented. An IGBT-ESD device includes a semiconductor substrate and patterned insulation regions disposed on the semiconductor substrate defining a first active region and a second active region. A high-V N-well is formed in the first active region of the semiconductor substrate. A P-body doped region is formed in the second active region of the semiconductor substrate, wherein the high-V N-well and the P-body doped region are separated with a predetermined distance exposing the semiconductor substrate. A P+doped drain region is disposed in the high-V N-well. A P+diffused region and an N+doped source region are disposed in the P-body doped region. A gate structure is disposed on the semiconductor substrate with one end adjacent to the N+doped source region and the other end extending over the insulation region.
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Chang Jui-Chun
Jou Yeh-Ning
Tu Shang-Hui
Wu Chen-Wei
Stark Jarrett
Vanguard International Semiconductor Corporation
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